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45g Thermal Conductive Silicone CPU Bonding Adhesive Glue.
K-5204K both silicone thermal plastic bonding effect, and good thermal conductivity (heat dissipation) properties. After a neutral silicone elastomer reinforced plastic, after curing adhesive has good resistance to changes in the level performance, long-term use will not fall off, no contact with the gap reduced cooling effect; because of the reinforcement of the rubber have more high bond strength, shear strength ≥15 kg / cm. It has excellent resistance to high temperature performance. Its operating temperature range of -60 ~ 280 ; The adhesive is a one component room temperature curing adhesive with 100 ml metal hose package easy to use. The main application is to replace the thermal grease (paste) as the CPU and the heat sink, intelligent control thyristor module and heat sink filled adhesive, electrical power between the module and heat sink. After this glue can be removed with traditional cards and screw connections, the result is to bring more reliable filling cooling, simpler process, more economical cost. Specifications: Instructions: Package Included: